Non-spherical colloidal silica nanoparticle was prepared by a simple new method,and its particle size distribution and s......

Copper has replaced aluminum as the main interconnect material due to its low resistivity and high electromigration resi......

The growth of epitaxial layer of SiC wafer requires the surface of SiC substrate to reach an atomic scale accuracy.To so......

采用雾化施液化学机械抛光(CMP)的方法, 以材料去除速率和表面粗糙度为评价指标, 选取最适合硒化锌抛光的磨料, 通过单因素实验对......